Xilinx support accelerates customer productivity and time-to-market from system development to product end-of-life.
Xilinx has a long legacy of delivering products and services that accelerate the customer design process. Customers have access to an infrastructure that is continuously tuned-to-target defect-free product experiences. While this initiative takes a tremendous level of focus and partnership, the rewards have been extraordinary.
Xilinx has proven repeatedly that structured customer collaborations with high-volume customer applications can achieve levels close to, or at, zero PPM. This disciplined approach creates synergy between Xilinx and customers through joint-design reviews, design evaluation samples, and focused teamwork. These collaborative efforts often extend to provide contract manufacturers with customer engineering support. By working with Xilinx, designers can enjoy superior results through:
Every Xilinx device has a unique 2D barcode linked to its DNA which contains historical data for traceability from wafer to POS (Point-of-Sale).
This 2D barcode enables advanced data analytics through AI / Machine Learning to:
The 2D barcode can be read using Xilinx Go App which can be downloaded: https://www.xilinx.com/about/app-download.html.
Additional information about 2D barcode can be found at AR# 6713.
Xilinx sales offices, representatives and authorized distributors around the world are available to support customers.
Xilinx support page has an extensive knowledge database to answer customer questions.
Xilinx and customers—with support from technology suppliers and partners—make-up a tightly linked community. The entire ecosystem must succeed to drive-up the quality of the end-solutions enabled by Xilinx innovations. Periodic quality scorecards provided by customers are therefore the true measure of Xilinx quality.
Fault-isolation and failure-analysis enable our engineering to determine the cause of an issue by scripts, patterns, tools, simulations and other diagnostic methodologies. These electrical-fault diagnostic methods can pinpoint the exact cause and location of the failing circuit. Our failure analysis labs process, collect and analyze data to determine the cause of the failure. Physical inspection of the fault-isolated location in the silicon are mostly the stages during failure analysis. It is a subsequent examination of the cause or cause-of-failure using a wide array of methods, especially microscopy and spectroscopy. Additional Xilinx customer-facing quality hallmarks include:
Xilinx customer RMA cases is on the decline over the past 10 years, as show in Continuous Improvement. Our zero-defect strategy and exceeding industry reliability benchmark is working and we expect to improve even further with continuous improvement.
In case any defect is found, Xilinx will relentless drive to discover root-causes of failures. Xilinx has advanced tools capable of analyzing the latest technology nodes beyond 16nm, where even a few micro-amps of current leakage can be detected.
Xilinx qualifies products and processes prior to production release. Changes in design, manufacturing, testing, or obsolescence of Xilinx products is communicated following established industry standards.
Xilinx uses JEDEC (JESD46 / PCN and JESD48 / PDN) standards, as the foundation for our customer notification processes related to change or obsolescence. This is supported by a change management infrastructure extended into Xilinx supply chain.
Xilinx communicates through XCN Notifications (Product Change Notice / PCN and Product Discontinuation Notice / PDN) which are posted on Xilinx.com.
Customer needing notification for changes and obsolescence are required to register on Xilinx.com. Register today and personalize your “Alerts” area to include Customer Notifications.