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Technology
Core Technologies
3D ICs
AMD 3D ICs utilize Stacked Silicon Interconnect technology to provide the next level of advanced system integration for applications that require high logic density and tremendous computational performance.
AI Engines represent a revolutionary architecture for AI inference and signal processing, consisting of hundreds of highly flexible vector processing engines tightly integrated for massive parallelism, servicing the compute needs for a breadth of applications.
Our comprehensive TUV SUD certified design flow enables customers to simplify and accelerate certifications based on functional safety specifications across Aerospace & Defense, Automotive, Medical, and Industrial markets.
AMD memory interface solutions are based on hardware-verified reference designs and software tools that enable you to quickly generate your own custom design.
PCI Express (PCIe) is a high speed serial interconnect that can be leveraged for Communications, Data-center, Embedded, Test & Measurements, Military and Desktop applications.
AMD has integrated multi-giga-sample RF data converters into its 16nm MPSoCs devices for the first programmable RFSoC, eliminating the need for discrete ADCs and DACs.