AR# 10970


3.1i Modular Design - MAP "ERROR:Pack:683 - Unable to pack the following symbols concurrently..."


Keywords: assembly, I/O, module, ports, map

Urgency: Standard

General Description:
In Modular Design flow, MAP is unable to pack I/O components if the components (IBUF, BUFP, OBUF) are located inside a module.

The following error appears in the MAP report during assembly flow:

"ERROR:Pack:683 - Unable to pack the following symbols concurrently into an empty I/O component:
PAD symbol "PCI_CORE/PCLK.PAD" (Pad Signal = PCLK)
The buffer PCI_CORE/XPCI_CKI can not merge with signal PCLK. The signal has a NOMERGE property."



This problem is fixed in the latest 3.1i Service Pack, available at:
The first service pack containing the fix is 3.1i Service Pack 7.


If an IBUF/OBUF is connected to an IOB register, the register and buffer must exist in the same module.

MAP will issue this error if you have an I/O buffer in a top-level design that is connected to an IOB register in a module.
MAP will not optimize across the module boundary, so this configuration cannot be merged.
AR# 10970
日付 06/10/2003
ステータス アーカイブ
種類 一般
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