Can Xilinx Devices be wave soldered or immersed in solder? What are the guidelines if the device is to be wave-soldered?
Since most Xilinx device packages are manufactured from plastic, it is not suggested to wave-solder the devices, or to immerse them in solder.
If the device is to be wave-soldered, special care must be taken to ensure that the maximum temperature of the package body does not exceed 220 degrees C and that all components are kept in a dry condition. Unless specifically stated for any package type, dry condition implies less than 0.12% moisture by package weight.
Please refer to the "Packages and Thermal Characteristics" section of the Xilinx Programmable Logic Data Book for more information on handling components that are moisture-sensitive.