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AR# 156

PACKAGING: PLCC Chips fail on multichip board--swapped in chips function ok.

説明

Plastic package chips are sensitive to moisture. Chips may be ordered as
"baked", or users should bake the devices themselves to remove any residual
moisture. If this is not done, some board assembly instertion methods may
damage the chip.

ソリューション

AR# 156
作成日 08/31/2007
最終更新日 11/05/1996
ステータス アーカイブ
タイプ ??????