UPGRADE YOUR BROWSER

We have detected your current browser version is not the latest one. Xilinx.com uses the latest web technologies to bring you the best online experience possible. Please upgrade to a Xilinx.com supported browser:Chrome, Firefox, Internet Explorer 11, Safari. Thank you!

AR# 2744

Packaging - HQ: Is the copper heatsink on the HQ packages grounded?

説明

General Description:

Is the copper heatsink on the bottom of the HQ304, HQ240, and HQ208 devices grounded? How can I safely ground the device to help dissipate heat?

ソリューション

On the HQ240, the heatsink is 24mm x 24mm; on the HQ208, it is 21mm x 21mm.

On both packages the heatsink is grounded, so there are no problems with connecting the heatsink to the board ground. But because the heatsink is grounded, care must be taken so that the pins on the package do not short to the heatsink.

The HQ304 may not have the heatsink grounded internally--it must be grounded externally.

AR# 2744
作成日 08/21/2007
最終更新日 05/14/2014
ステータス アーカイブ
タイプ 一般