Does Xilinx utilize the TAB (tape automated bonding) process?
First, what exactly is "TAB"?
It is a process in which silicon chips are joined to patterned metal traces (leads) on polymer tape to form inner lead bonds; subsequently, the leads are attached to the next level of the assembly -- typically a substrate or board -- to form outer lead bonds. TAB is the technique of interconnecting silicon with beam bonding (as opposed to wire bonding).
Xilinx does not use a TAB process; we use wire bonding for all of our packages except Flip-Chip (FF and BF). For Flip-Chip, flip-chip bumping is used.