UltraScale+ Device Packaging and Pinouts Product Specification User Guide (UG575)

Document ID: UG575
Release Date: 2023-05-10
Revision: 1.19 English

Packaging Overview
Introduction to the UltraScale Architecture
Introduction to UltraScale and UltraScale+ FPGAs Packaging and Pinouts
Differences from Previous Generations
Device/Package Combinations
Gigabit Transceiver Channels by Device/Package
User I/O Pins by Device/Package
Pin Definitions
Footprint Compatibility between Packages
Die Level Bank Numbering Overview
Banking and Clocking Summary
GTH/GTY/GTM Columns
I/O Banks
Clocking
Bank Locations of Dedicated and Multi-Function Pins
SYSMON, Configuration, PCIe, Interlaken, and 100GE Integrated Blocks
Device Diagrams
XCKU025 Bank Diagrams
XCKU035 Bank Diagrams
XCKU040 and XQKU040 Bank Diagrams
XCKU060 and XQKU060 Bank Diagrams
XCKU085 Bank Diagrams
XCKU095 and XQKU095 Bank Diagrams
XCKU115 and XQKU115 Bank Diagrams
XCVU065 Bank Diagrams
XCVU080 Bank Diagrams
XCVU095 Bank Diagrams
XCVU125 Bank Diagrams
XCVU160 Bank Diagrams
XCVU190 Bank Diagrams
XCVU440 Bank Diagrams
XCAU7P and XAAU7P Bank Diagrams
XCAU10P and XAAU10P Bank Diagrams
XCAU15P and XAAU15P Bank Diagrams
XCAU20P Bank Diagrams
XCAU25P Bank Diagrams
XCKU3P Bank Diagrams
XCKU5P and XQKU5P Bank Diagrams
XCKU9P Bank Diagrams
XCKU11P Bank Diagrams
XCKU13P Bank Diagrams
XCKU15P and XQKU15P Bank Diagrams
XCKU19P Bank Diagrams
XCVU3P and XQVU3P Bank Diagrams
XCVU5P Bank Diagrams
XCVU7P and XQVU7P Bank Diagrams
XCVU9P Bank Diagrams
XCVU11P and XQVU11P Bank Diagrams
XCVU13P Bank Diagrams
XCVU19P Bank Diagrams
XCVU23P Bank Diagrams
XCVU27P Bank Diagrams
XCVU29P Bank Diagrams
XCVU31P Bank Diagrams
XCVU33P Bank Diagrams
XCVU35P and XCVU45P Bank Diagrams
XCVU37P and XCVU47P Bank Diagrams
XCVU57P Bank Diagrams
Package Files
About ASCII Package Files
Package Specifications Designations
Evaluation Only
Engineering Sample
Production
ASCII Pinout Files
Device Diagrams
Summary
FBVA676 Package– XCKU035 and XCKU040 and RBA676 Package– XQKU040
SFVA784 ( XCKU035 and XCKU040 )
FBVA900 ( XCKU035 and XCKU040 )
FFVA1156 ( XCKU025 )
FFVA1156 ( XCKU035 )
FFVA1156 ( XCKU040 ) and RFA1156 ( XQKU040 )
FFVA1156 ( XCKU060 ) and RFA1156 ( XQKU060 )
FFVA1156 ( XCKU095 ) and RFA1156 ( XQKU095 )
FFVA1517 ( XCKU060 )
FLVA1517 ( XCKU085 and XCKU115 )
FFVC1517 ( XCKU095 )
FLVD1517 ( XCKU115 ) and RLD1517 ( XQKU115 )
FFVB1760 ( XCKU095 )
FLVB1760 ( XCKU085 )
FLVB1760 ( XCKU115 )
FLVD1924 ( XCKU115 )
FLVF1924 ( XCKU085 )
FLVF1924 ( XCKU115 ) and RLF1924 ( XQKU115 )
FLVA2104 ( XCKU115 )
FFVB2104 ( XCKU095 )
FLVB2104 ( XCKU115 )
FFVC1517 ( XCVU065 )
FFVC1517 ( XCVU080 and XCVU095 )
FFVD1517 ( XCVU080 and XCVU095 )
FLVD1517 ( XCVU125 )
FFVB1760 ( XCVU080 and XCVU095 )
FLVB1760 ( XCVU125 )
FFVA2104 ( XCVU080 and XCVU095 )
FLVA2104 ( XCVU125 )
FFVB2104 ( XCVU080 and XCVU095 )
FLVB2104 ( XCVU125 )
FLGB2104 ( XCVU160 and XCVU190 )
FFVC2104 ( XCVU095 )
FLVC2104 ( XCVU125 )
FLGC2104 ( XCVU160 and XCVU190 )
FLGB2377 ( XCVU440 )
FLGA2577 ( XCVU190 )
FLGA2892 ( XCVU440 )
SBVC484 ( XCAU7P and XAAU7P )
FFVB676 ( XCAU10P and XAAU10P )
FFVB676 ( XCAU15P and XAAU15P )
FFVB676 ( XCAU20P )
FFVB676 ( XCAU25P )
SBVB484 ( XCAU10P and XAAU10P )
SBVB484 ( XCAU15P and XAAU15P )
SFVB784 ( XCAU20P )
SFVB784 ( XCAU25P )
UBVA368 ( XCAU10P )
UBVA368 ( XCAU15P )
FFVA676 ( XCKU3P and XCKU5P )
FFVB676 ( XCKU3P and XCKU5P ) and FFRB676 ( XQKU5P )
SFVB784 ( XCKU3P and XCKU5P ) and SFRB784 ( XQKU5P )
FFVD900 ( XCKU3P and XCKU5P )
FFVD900 ( XCKU11P )
FFVE900 ( XCKU9P )
FFVE900 ( XCKU13P )
FFVA1156 ( XCKU11P )
FFVA1156 ( XCKU15P ) and FFRA1156 ( XQKU15P )
FFVE1517 ( XCKU11P )
FFVE1517 ( XCKU15P ) and FFRE1517 ( XQKU15P )
FFVA1760 ( XCKU15P )
FFVE1760 ( XCKU15P )
FFVJ1760 ( XCKU19P )
FFVB2104 ( XCKU19P )
FFVC1517 ( XCVU3P ) and FFRC1517 ( XQVU3P )
FFVC1517 ( XCVU3P ) and FFRC1517 ( XQVU3P )
FSVJ1760 ( XCVU23P )
FLGF1924 ( XCVU11P )
FSVH1924 ( XCVU31P )
FLVA2104 ( XCVU5P and XCVU7P ) and FLRA2104 ( XQVU7P )
FLGA2104 ( XCVU9P )
FHGA2104 ( XCVU13P )
FLVB2104 ( XCVU5P and XCVU7P ) and FLRB2104 ( XQVU7P )
FLGB2104 ( XCVU9P )
FLGB2104 ( XCVU11P )
FHGB2104 ( XCVU13P )
FLVC2104 ( XCVU5P and XCVU7P )
FLGC2104 ( XCVU9P )
FLGC2104 ( XCVU11P ) and FLRC2104 ( XQVU11P )
FHGC2104 ( XCVU13P )
FSGD2104 ( XCVU9P )
FSGD2104 ( XCVU11P )
FIGD2104 ( XCVU13P )
FIGD2104 ( XCVU27P )
FIGD2104 ( XCVU29P )
FSVH2104 ( XCVU33P )
FSVH2104 ( XCVU35P and XCVU45P )
FLGA2577 ( XCVU9P )
FLGA2577 ( XCVU11P )
FLGA2577 and FSGA2577 ( XCVU13P )
FSGA2577 ( XCVU27P )
FSGA2577 ( XCVU29P )
FSVH2892 ( XCVU35P and XCVU45P )
FSVH2892 ( XCVU37P and XCVU47P )
FSVK2892 ( XCVU57P )
FSVA3824 ( XCVU19P )
FSVB3824 ( XCVU19P )
VSVA1365 ( XCVU23P )
Mechanical Drawings
Summary
UBVA368 Flip-Chip, Fine-Pitch BGA ( XCAU10P and XCAU15P )
SBVB484 Flip-Chip, Chip-Scale (0.8 mm) BGA ( XCAU10P , XAAU10P , XCAU15P , and XAAU15P )
SBVC484 Flip-Chip, Chip-Scale (0.8 mm) BGA ( XCAU7P and XAAU7P )
FBVA676 Bare-die Flip-Chip, Fine-Pitch BGA ( XCKU035 and XCKU040 )
FFVA676 and FFVB676 Flip-Chip, Fine-Pitch BGA ( XCAU10P , XAAU10P , XCAU15P , XAAU15P , XCAU20P , XCAU25P , XCKU3P , and XCKU5P )
FFRB676 Ruggedized Flip-Chip, Fine-Pitch BGA ( XQKU5P )
RBA676 Ruggedized Flip-Chip, Fine-Pitch BGA ( XQKU040 )
SFVA784 Flip-Chip, Chip-Scale (0.8 mm) BGA ( XCKU035 and XCKU040 )
SFVB784 Flip-Chip, Super-Fine Pitch (0.8 mm) BGA ( XCAU20P , XCAU25P , XCKU3P , and XCKU5P )
SFRB784 Ruggedized Flip-Chip, Super Fine-Pitch BGA ( XQKU5P )
FBVA900 Bare-die Flip-Chip, Fine-Pitch BGA ( XCKU035 and XCKU040 )
FFVD900 ( XCKU3P , XCKU5P , and XCKU11P ) and FFVE900 ( XCKU9P and XCKU13P )
FFVA1156 Flip-Chip, Fine-Pitch BGA ( XCKU025 , XCKU035 , and XCKU040 )
FFVA1156 Flip-Chip, Fine-Pitch BGA ( XCKU060 , XCKU095 , and XCKU11P )
FFVA1156 Flip-Chip, Fine-Pitch BGA ( XCKU15P )
FFRA1156 Ruggedized Flip-Chip, Fine-Pitch BGA ( XQKU15P )
RFA1156 Ruggedized Flip-Chip, Fine-Pitch BGA ( XQKU040 )
RFA1156 Ruggedized Flip-Chip, Fine-Pitch BGA ( XQKU060 and XQKU095 )
VSVA1365 Flip-Chip, Fine-Pitch BGA ( XCVU23P )
FFVA1517, FFVC1517, and FFVD1517 Flip-Chip, Fine-Pitch BGA ( XCKU060 , XCKU095 , XCVU065 , XCVU080 , XCVU095 )
FFVC1517 ( XCVU3P ) and FFVE1517 ( XCKU11P and XCKU15P ) Flip-Chip, Fine-Pitch BGA
FFRC1517 ( XQVU3P ) and FFRE1517 ( XQKU15P ) Ruggedized Flip-Chip, Fine-Pitch BGA
FLVA1517 ( XCKU085 and XCKU115 ) and FLVD1517 ( XCKU115 and XCVU125 ) Flip-Chip, Fine-Pitch BGA
RLD1517 Ruggedized Flip-Chip, Fine-Pitch BGA ( XQKU115 )
FFVA1760 Flip-Chip, Fine-Pitch BGA ( XCKU15P )
FFVB1760 Flip-Chip, Fine-Pitch BGA ( XCKU095 , XCVU080 , and XCVU095 )
FLVB1760 Flip-Chip, Fine-Pitch BGA ( XCKU085 , XCKU115 , and XCVU125 )
FFVE1760 Flip-Chip, Fine-Pitch BGA ( XCKU15P )
FFVJ1760 Flip-Chip, Fine-Pitch BGA ( XCKU19P )
FSVJ1760 Flip-Chip, Fine-Pitch BGA ( XCVU23P )
FLVD1924 ( XCKU115 ) and FLVF1924 ( XCKU085 and XCKU115 ) Flip-Chip, Fine-Pitch BGA
FLGF1924 ( XCVU11P ) Flip-Chip, Fine-Pitch BGA
RLF1924 ( XQKU115 ) Ruggedized Flip-Chip, Fine-Pitch BGA
FSVH1924 ( XCVU31P ) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
FFVA2104 ( XCVU080 and XCVU095 ) and FFVB2104 ( XCKU095 , XCVU080 , and XCVU095 ) Flip-Chip, Fine-Pitch BGA
FFVB2104 ( XCKU19P ) Flip-Chip, Fine-Pitch BGA
FHGA2104 ( XCVU13P ) Flip-Chip, Fine-Pitch BGA
FHGB2104 ( XCVU13P ) and FHGC2104 ( XCVU13P ) Flip-Chip, Fine-Pitch BGA
FLVA2104 ( XCKU115 and XCVU125 ) and FLVB2104 ( XCKU115 and XCVU125 ) Flip-Chip, Fine-Pitch BGA
FLVA2104 ( XCVU5P and XCVU7P ) and FLVB2104 ( XCVU5P and XCVU7P ) Flip-Chip, Fine-Pitch BGA
FLRA2104 ( XQVU7P ) and FLRB2104 ( XQVU7P ) Ruggedized Flip-Chip, Fine-Pitch BGA
FLGA2104 ( XCVU9P ) Flip-Chip, Fine-Pitch BGA
FLGB2104 ( XCVU160 and XCVU190 ) and FLGC2104 ( XCVU160 and XCVU190 ) Flip-Chip, Fine-Pitch BGA
FLGB2104 ( XCVU9P and XCVU11P ) and FLGC2104 ( XCVU11P ) Flip-Chip, Fine-Pitch BGA
FLRC2104 ( XQVU11P ) Ruggedized Flip-Chip, Fine-Pitch BGA
FFVC2104 ( XCVU095 ) Flip-Chip, Fine-Pitch BGA
FLGC2104 ( XCVU9P ) Flip-Chip, Fine-Pitch BGA
FLVC2104 ( XCVU125 ) Flip-Chip, Fine-Pitch BGA
FLVC2104 ( XCVU5P and XCVU7P ) Flip-Chip, Fine-Pitch BGA
FIGD2104 ( XCVU13P , XCVU27P , and XCVU29P ) Flip-Chip, Fine-Pitch BGA
FSGD2104 ( XCVU9P ) Flip-Chip, Fine-Pitch BGA
FSGD2104 ( XCVU11P ) Flip-Chip, Fine-Pitch BGA
FSVH2104 ( XCVU33P ) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
FSVH2104 ( XCVU35P and XCVU45P ) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
FLGB2377 Flip-Chip, Fine-Pitch BGA ( XCVU440 )
FLGA2577 Flip-Chip, Fine-Pitch BGA ( XCVU190 )
FLGA2577 Flip-Chip, Fine-Pitch BGA ( XCVU9P and XCVU13P )
FLGA2577 Flip-Chip, Fine-Pitch BGA ( XCVU11P )
FSGA2577 Flip-Chip, Fine-Pitch BGA ( XCVU13P , XCVU27P , and XCVU29P )
FLGA2892 Flip-Chip, Fine-Pitch BGA ( XCVU440 )
FSVH2892 ( XCVU35P and XCVU45P ) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
FSVH2892 ( XCVU37P and XCVU47P ) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
FSVK2892 ( XCVU57P ) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
FSVA3824 and FSVB3824 ( XCVU19P ) Flip-Chip, Fine-Pitch, Lidless with Stiffener Ring, BGA
Package Marking
Introduction
Packing and Shipping
Introduction
Soldering Guidelines
Soldering Guidelines
Sn/Pb Reflow Soldering
Pb-Free Reflow Soldering
Post Reflow/Cleaning/Washing
Strain Gauge Measurement
Solder Paste
Component Placement
Recommended PCB Design Rules for BGA Packages
BGA Packages
Stencil
Uniform Stencil Aperture Design
Non-Uniform (Bull’s Eye) Stencil Aperture Design
Bull’s Eye Stencil Recommendation
Edge Bonding
Summary
Edge Bonding Implementation
Component Clearance Surrounding Edge Bond
Edge Bond Removal
Underfill Guidelines
Underfill Implementation
Underfill Keep-out Requirements
Underfill Rework
Step 1: Pre-bake
Step 2: SRT Machine Program Creation
Step 3: Machine and Board Setup
Step 4 (Stage 1): Pre-Heating
Step 5 (Stage 2): Component Removal
Step 6 (Stage 3): Rework Site Cleaning
Conformal Coating
Thermal Specifications
Introduction
Thermal Resistance Data
Support for Thermal Models
Thermal Management Strategy
Introduction
Flip-Chip Packages
System Level Heat Sink Solutions
Thermal Interface Material
Types of TIM
Guidelines for Thermal Interface Materials
Thermal Conductivity of the Material
Electrical Conductivity of the Material
Spreading Characteristics of the Material
Long-Term Stability and Reliability of the Material
Ease of Application
Applied Pressure from Heat Sink to the Package via Thermal Interface Materials
Heat Sink Removal
Instructions for Removal of Phase-change Material
Separate the Components
Scrape Away Thick Residue
Clean Remaining Residue with Solvent
Working with Laird Material
Measurement Debug
Heat Sink Guidelines for Bare-die Flip-Chip Packages
Heat Sink Attachments for Bare-die FB Packages
Silicon and Decoupling Capacitors Height Consideration
Types of Heat Sink Attachments
Heat Sink Attachment
Component Pick-up Tool Consideration
Heat Sink Attachment Process Considerations
Standard Heat Sink Attach Process with Thermal Conductive Adhesive
Standard Heat Sink Attach Process with Thermal Adhesive Tape
Push-Pin and Shoulder Screw Heat Sink Attachment Process with Phase Change Material (PCM) Application
Mechanical and Thermal Design Guidelines for Lidless Flip-chip Packages
Introduction
Lidless Flip-Chip Packages
Additional Resources and Legal Notices
Finding Additional Documentation
Documentation Portal
Documentation Navigator
Design Hubs
Support Resources
References
Revision History
Please Read: Important Legal Notices

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