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Kria K24 System-on-Module Industrial

作成者: AMD

New to the Kria™ portfolio, the cost-optimized K24 SOM offers a smaller form factor and power efficiency for a wide range of target applications. Leverage its lower latency and deterministic performance for developing highly reliable end systems. The K24 SOM is available in Commercial and Industrial Grade variants for production deployment.

グレード:
  • 価格: $350.00 MSRP
  • パーツ番号:
    • SM-K24-XCL2GI
  • リードタイム: 8 weeks
  • デバイス サポート: Zynq UltraScale+ MPSoC
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WARNING: This product can expose you to chemicals including Diisononyl Phthalate (DINP), which is known to the State of California to cause cancer, birth defects, or other reproductive harm. For more information, go to: www.P65Warnings.ca.gov .

  • Product Features

    Power-efficient Compute

    Develop power-efficient and highly deterministic industrial solutions for volume deployment

    Up to 2X latency advantage vs. a standard system on chip like Texas Instruments AM64xx and similar products for single-axis drives applications1

    Scalable & Adaptable

    Smaller form factor and connector compatible with K26 SOM-enabling migration

    Future ready for HW and SW changes, offering adaptability for any sensor or interface as standards evolve

    Easy Signal Processing

    Pre-built HW acceleration with Vitis™ motor control libraries

    Out-of-the-box ready with KD240 Drives Starter Kits and the App Store as well as featuring support for more development flows, including Python™ and the MATLAB® Simulink® environment

  • General Specifications

    Dimensions (with thermal enclosure)

    60 mm x 42 mm x 11 mm (with thermal enclosure)

    Application Processor

    Quad-core Arm® Cortex®-A53 MPCore™ at 1.33 GHz

    Real-Time Processor

    Dual-core Arm Cortex-R5F MPCore at 553 MHz

    Graphics Processing Unit

    Arm Mali™-400 MP2 at 600 MHz

    Deep Learning Processor Unit (DPU)

    INT8 (852 GOPs with B2304 DPU)

    Trusted Platform Module (TPM)

    Infineon 2.0

    Memory On-Chip*

    9.4 Mb on-chip SRAM

    Memory On-SOM

    2 GB, 32-bit LPDDR4 @ 1066 Mbps w/ ECC configuration** and 32 GB eMMC

    High-Speed PS Connectivity (GTR)

    PCIe® Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort, 4x tri-mode gigabit Ethernet

    General PS Connectivity (MIO)

    2x USB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO

    GTR 6 Gbps Transceivers

    4

    PS MIO (1.8V)

    49

    PL High-density (HD) I/O (3.3V)

    23

    PL High-performance (HP) I/O (1.8V)

    56

    System Logic Cells (K)

    154

    DSP Slices

    360

    Typical Power

    5W

    Maximum Power***

    10W

    Thermal Interface

    Passive (clamshell thermal plates)

    Commerical Speed & Temp Grade

    -2 speed grade, low voltage and 0 to 85°C temperature range

    Industrial Speed & Temp Grade

    -2 speed grade, low voltage and –40 to 100°C temperature range

*On-chip memory (Mb) = max. distributed RAM + total Block RAM + UltraRAM
**K24 I-grade only supports ECC memory
***Estimated and subject to change based on actual hardware evaluation